IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.
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Representative temperature profile for thermal cycle test conditions.
Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute usually 10 to 14C per minute to avoid thermal shock with cycles per hour. Per IPC, temperature extremes are ippc on the product category with the low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.
When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.
Solder Joint Reliability | NTS
Training Media Permissible Uses. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. See More See Less. 971
Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free ioc joints. This provides you with useful technical information for future designs, saving you time and money.
Thermal Cycling is the most common method of testing Solder Joint Reliability. Common test specifications include: Please allow 2 business days for us to review and process your order.
Product Description Product Details Back. Common test specifications include:. Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits.
Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.